Coverage (30d)
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2Timeline
Huawei2026-05-31
Huawei targets 1µm bond pitch for 2027 Kirin chips
Huawei2026-05-30
Huawei targets 1.4nm-equivalent density by 2031 using Tau Scaling Law
Huawei2026-05-25
Kirin chips with LogicFolding architecture ship this fall
Huawei2026-05-18
Huawei presented the Tau (τ) Scaling Law at IEEE ISCAS
Moore Threads Technology2026-04-01
Reported Q1 2026 revenue growth and disclosed progress on 100,000-GPU AI training cluster
Moore Threads Technology2026-02-27
Achieved full-stack compatibility between MTT S5000 GPU and Alibaba Cloud's Qwen3.5 AI models
Huawei2026-02-26
Huawei joins Agentic AI Foundation alongside OpenAI and Google
Huawei2026-01-01
Huawei's 2026 Kirin chips with 1.5µm bond pitch to launch
Ecosystem
Huawei
developedTau (τ) Scaling Law2 src
developedKirin2 src
developedLogicFolding2 src
hiredXu Zhijun1 src
competes withMoore Threads Technology1 src
competes withNvidia1 src
Moore Threads Technology
competes withHuawei1 src
competes withCambricon1 src
competes withNvidia1 src