Microsoft committed over $50B in AI infrastructure by 2026

Disclosed three mechanical innovations for wafer-scale chip cooling: vertical power delivery, flexible interposers, direct-impingement cooling

Microsoft unveiled MAI-Thinking-1, a 35B active parameter reasoning model scoring 97% on AIME 2025.

Microsoft released RAMPART, a pytest-native framework for testing AI agent safety

Announced CS4 wafer-scale chip staying on 5nm due to SRAM scaling flattening.

Released SkillOpt, training agent skills in text space

Cerebras published benchmark results for Kimi K2.6 on CS-3, claiming 981 tokens/sec and 6.7× speedup over GPU cloud.

Released MAI-Transcribe-1, MAI-Voice-1, and MAI-Image-2 AI models

Claims 10x training speed over Nvidia H100 for GPT-3-scale models using WSE-3

5 new AI data center projects identified.