Coverage (30d)
8vs1
This Week
1vs1
Evidence
1 articlesRelationships
1Timeline
Huawei2026-06-01
Launched HarmonyOS 7 with Xiaoyi AI agent at HDC 2026
Huawei2026-05-31
Huawei targets 1µm bond pitch for 2027 Kirin chips
Huawei2026-05-30
Huawei targets 1.4nm-equivalent density by 2031 using Tau Scaling Law
Huawei2026-05-25
Kirin chips with LogicFolding architecture ship this fall
Huawei2026-05-18
Huawei presented the Tau (τ) Scaling Law at IEEE ISCAS
ASML2026-03-18
Production capacity for EUV lithography machines capped at ~100 units/year through 2030, creating AI hardware bottleneck
ASML2026-03-16
Maintains monopoly on EUV lithography machines essential for advanced AI chip production
Huawei2026-02-26
Huawei joins Agentic AI Foundation alongside OpenAI and Google
ASML2026-02-24
Announced breakthrough in EUV lithography technology, boosting light source power from 600W to 1,000W
ASML2026-02-24
Achieved major breakthrough in extreme ultraviolet lithography technology
Ecosystem
Huawei
developedKirin3 src
usesH1003 src
developedTau (τ) Scaling Law2 src
developedLogicFolding2 src
competes withNvidia2 src
competes withIntel1 src
ASML
partneredTSMC2 src
competes withChangXin Memory Technologies (CXMT)1 src
competes withHuawei1 src
competes withSemiconductor Manufacturing International Corporation1 src
developedEUV lithography machine1 src