Coverage (30d)
5vs5
This Week
2vs2
Evidence
1 articlesRelationships
1Timeline
Qualcomm2026-06-22
Qualcomm in talks to acquire Modular for $4B
Qualcomm2026-06-18
Launched AI data center program with a major hyperscaler customer for inference workloads.
TSMC2026-05-31
TSMC targets 4.5µm SoIC hybrid bonding for 2030 products
Qualcomm2026-05-04
Initial shipments of custom hyperscaler silicon expected
Qualcomm2026-05-01
Acquisition of Alphawave for custom ASIC capabilities
Qualcomm2026-05-01
Custom silicon deal with unnamed hyperscaler, shipments expected December 2026
Qualcomm2026-05-01
Dedicated CPU for agentic AI revealed
TSMC2026-04-01
Reportedly hit 'hard capacity wall' at 2nm production node, creating supply constraints
TSMC2026-01-01
Announced a $52-56 billion capital expenditure plan for 2026 to build 22 new advanced semiconductor fabs.
TSMC2026-01-01
TSMC cut 28nm wafer output by over 25% since early 2026, reallocating to advanced nodes N3, N2 and A16.
Ecosystem
Qualcomm
developedSnapdragon X2 Elite4 src
competes withIntel3 src
competes withNvidia2 src
acquiredAlphawave2 src
competes withApple2 src
developedOryon V21 src
TSMC
partneredIntel3 src
partneredNvidia2 src
partneredQualcomm1 src
partneredCerebras Systems1 src
usesEUV lithography machine1 src
developedCoWoS1 src