Coverage (30d)
3vs3
This Week
1vs0
Evidence
1 articlesRelationships
1Timeline
TSMC2026-05-31
TSMC targets 4.5µm SoIC hybrid bonding for 2030 products
Huawei2026-05-31
Huawei targets 1µm bond pitch for 2027 Kirin chips
Huawei2026-05-30
Huawei targets 1.4nm-equivalent density by 2031 using Tau Scaling Law
Huawei2026-05-25
Kirin chips with LogicFolding architecture ship this fall
Huawei2026-05-18
Huawei presented the Tau (τ) Scaling Law at IEEE ISCAS
TSMC2026-04-01
Reportedly hit 'hard capacity wall' at 2nm production node, creating supply constraints
Huawei2026-02-26
Huawei joins Agentic AI Foundation alongside OpenAI and Google
TSMC2026-01-01
Announced a $52-56 billion capital expenditure plan for 2026 to build 22 new advanced semiconductor fabs.
Huawei2026-01-01
Huawei's 2026 Kirin chips with 1.5µm bond pitch to launch
Ecosystem
TSMC
partneredIntel3 src
partneredNvidia2 src
partneredAMD1 src
partneredMediaTek1 src
partneredAmazon1 src
usesEUV lithography machine1 src
Huawei
developedTau (τ) Scaling Law2 src
developedKirin2 src
developedLogicFolding2 src
hiredXu Zhijun1 src
competes withMoore Threads Technology1 src
competes withNvidia1 src