TSMC net income jumped 77% to $22B in Q2 2026

IBM demonstrated sub-1-nanometer chip technology at IEDM conference.

TSMC targets 4.5µm SoIC hybrid bonding for 2030 products

Published article proposing layered architecture for recommendation systems to replace monolithic approaches

Introduced the Deep Neural Lesion (DNL) method for finding critical parameters in neural networks.

Reportedly hit 'hard capacity wall' at 2nm production node, creating supply constraints

Experienced stock decline due to AI displacement concerns from Claude Code capabilities

Stock price plunged 13.1% following Anthropic's COBOL tool announcement.

First Arizona fab started volume output in early 2026

TSMC cut 28nm wafer output by over 25% since early 2026, reallocating to advanced nodes N3, N2 and A16.