Coverage (30d)
3vs8
This Week
0vs2
Evidence
1 articlesRelationships
1Timeline
Huawei2026-05-31
Huawei targets 1µm bond pitch for 2027 Kirin chips
Huawei2026-05-30
Huawei targets 1.4nm-equivalent density by 2031 using Tau Scaling Law
Huawei2026-05-25
Kirin chips with LogicFolding architecture ship this fall
Huawei2026-05-18
Huawei presented the Tau (τ) Scaling Law at IEEE ISCAS
Intel2026-04-27
Intel demonstrated UCIe-S interconnect at ISSCC, beating 3nm EMIB with 3x higher data rate
Intel2026-04-08
Intel and SambaNova Systems jointly proposed a hybrid inference architecture blueprint for agentic AI workloads.
Intel2026-04-07
Announced it is joining the 'Terafab' project consortium with SpaceX, xAI, and Tesla to refactor silicon fabrication technology.
Huawei2026-02-26
Huawei joins Agentic AI Foundation alongside OpenAI and Google
Huawei2026-01-01
Huawei's 2026 Kirin chips with 1.5µm bond pitch to launch
Intel2025-01-01
Intel's Foveros Direct debuts with Clearwater Forest at 9µm pitch
Ecosystem
Huawei
developedTau (τ) Scaling Law2 src
developedKirin2 src
developedLogicFolding2 src
hiredXu Zhijun1 src
competes withMoore Threads Technology1 src
competes withNvidia1 src
Intel
partneredAMD3 src
developedEMIB2 src
partneredSambaNova Systems2 src
developedIntel Arrow Lake2 src
partneredUALink Consortium2 src
partneredGoogle1 src