Timeline
Booked Intel to package 3 million TPUs
Google is developing Frozen v2 chip, targeting deployment as early as 2028.
Google booked Intel to package 3 million TPUs by 2028
Google booked Intel to package 3 million TPUs by 2028
Google reported first negative free cash flow since 2004 IPO, driven by AI capex.
Added background execution and MCP support to Gemini API Managed Agents
TSMC net income jumped 77% to $22B in Q2 2026
TSMC targets 4.5µm SoIC hybrid bonding for 2030 products
Reportedly hit 'hard capacity wall' at 2nm production node, creating supply constraints
First Arizona fab started volume output in early 2026
Ecosystem
TSMC
Evidence (9 articles)
TSMC's 1.4nm Fab Slips to Mid-2028 as AI Chip Demand Tightens
Jul 30, 2026Nvidia Vows 'Giant Amounts' of Vera Rubin as Blackwell Delays Bite
Jul 15, 2026Google TPU Humufish Drops TSMC CoWoS for Intel EMIB-T
Jul 1, 2026China PLP System Passes Validation at 510×515mm Panel Size
Jul 6, 2026Google Splits TPU Line: 8t for Training, 8i for Inference
Apr 27, 2026Google Chooses Intel EMIB-T for 9th-Gen TPUs, Breaking TSMC's CoWoS Monopoly
Jul 15, 2026ByteDance Builds In-House AI CPUs for TikTok-Scale Agent Inference
May 31, 2026Google Books Intel for 3M+ TPUs in 2028 as TSMC CoWoS Hits Capacity Wall
Jun 10, 2026+ 1 more articles