Timeline
Intel plans to launch new AI data center chip targeting Nvidia and AMD
Plans to launch a new AI data center chip targeting Nvidia and AMD
TSMC net income jumped 77% to $22B in Q2 2026
TSMC targets 4.5µm SoIC hybrid bonding for 2030 products
Intel demonstrated UCIe-S interconnect at ISSCC, beating 3nm EMIB with 3x higher data rate
Intel and SambaNova Systems jointly proposed a hybrid inference architecture blueprint for agentic AI workloads.
Announced it is joining the 'Terafab' project consortium with SpaceX, xAI, and Tesla to refactor silicon fabrication technology.
Reportedly hit 'hard capacity wall' at 2nm production node, creating supply constraints
First Arizona fab started volume output in early 2026
TSMC cut 28nm wafer output by over 25% since early 2026, reallocating to advanced nodes N3, N2 and A16.
Ecosystem
TSMC
Intel
Evidence (9 articles)
Elon Musk Says Global Chip Fabs Supply Only 2% of Tesla's AI Compute Needs, Driving Terafab Build
Mar 22, 2026Nvidia Vows 'Giant Amounts' of Vera Rubin as Blackwell Delays Bite
Jul 15, 2026Google TPU Humufish Drops TSMC CoWoS for Intel EMIB-T
Jul 1, 2026Huawei Hits 1.5µm Bond Pitch in Kirin 2026 Chips, Beats TSMC
May 31, 2026China PLP System Passes Validation at 510×515mm Panel Size
Jul 6, 2026Google Chooses Intel EMIB-T for 9th-Gen TPUs, Breaking TSMC's CoWoS Monopoly
Jul 15, 2026ByteDance Builds In-House AI CPUs for TikTok-Scale Agent Inference
May 31, 2026Google Books Intel for 3M+ TPUs in 2028 as TSMC CoWoS Hits Capacity Wall
Jun 10, 2026+ 1 more articles