co packaged optics
12 articles about co packaged optics in AI news
TSMC, Intel, Samsung, GF Split on Co-Packaged Optics
Four foundries—TSMC, Intel, Samsung, GlobalFoundries—are pursuing distinct co-packaged optics strategies as electrical interconnects fail beyond 200-400 Gb/s per lane. The approaches are not directly comparable, reflecting divergent packaging bets.
Ayar Labs Joins NVIDIA NVLink Fusion Ecosystem for Co-Packaged Optics
Ayar Labs joined NVIDIA's NVLink Fusion ecosystem to bring co-packaged optics to AI factories, following its $500M Series E and alongside Lightmatter's similar move.
Foxconn to Mass-Produce 10,000+ CPO Optical Switches for AI in Q3 2026
Foxconn's manufacturing arm will begin volume production of advanced co-packaged optics (CPO) switches in Q3 2026, targeting over 10,000 units. This move directly addresses the critical bandwidth and power bottlenecks in next-generation AI data center infrastructure.
TSMC Pushes CPO, CoPoS; AUO Eyes Test Partner Role
TSMC advances COUPE and CoPoS; AUO seeks testing role. Report via @dnystedt, with Ennostar, Tyntek, GCS as potential supply chain partners.
Lightmatter Photonics Joins Nvidia NVLink Fusion for AI Interconnects
Lightmatter joins Nvidia NVLink Fusion with photonic interconnects. Nvidia Kyber rack delayed to 2028.
Nvidia Commits $6.5B to Photonics in Supply Chain Bet on AI's Next Bottleneck
Nvidia has invested over $6.5 billion across four photonics suppliers since March 2026, pairing equity stakes with multi-billion-dollar purchase commitments. The deals coincide with capacity expansion announcements from Coherent, Nokia, and Japan's JX Advanced Metals, and signal that optical interco
Nvidia Partners Corning for US Fiber Manufacturing, Prepaying Billions
Nvidia partners Corning for US fiber manufacturing with multibillion-dollar prepayments, increasing domestic capacity by 50%+ for AI GPU cluster interconnects.
AMD Backs UALink Open Interconnect to Challenge NVIDIA NVLink in AI
AMD is supporting the newly formed UALink Consortium, which aims to create an open standard for connecting AI accelerators. This move challenges NVIDIA's control over the critical NVLink technology that underpins its AI data center systems.
Silicon Photonics Breakthrough Enters Mass Production, Paving Way for Next-Generation AI Infrastructure
STMicroelectronics has begun mass production of its PIC100 silicon photonics platform, enabling 800G and 1.6T data rates critical for AI data centers. This breakthrough technology replaces copper with light for faster, more efficient data transmission between AI accelerators.
Lumentum CEO: Indium Phosphide Shortage Will Top Memory's
Lumentum CEO warns indium phosphide shortage will exceed memory's; Nvidia invested $2B each in Lumentum and Coherent to secure laser supply.
NJ Voters Back AI Data Center Bans as NIMBY Push Grows
54% of New Jersey voters support banning AI data centers, per a Jan 2026 poll. Nationally, 49% oppose local construction, threatening hyperscaler buildout plans.
China's DFSX SuperNode Doubles GB200 Memory Bandwidth on 14nm
China's DFSX SuperNode claims 2x GB200 memory bandwidth using 14nm vertical towers, but lacks benchmarks or ship dates, warranting skepticism.