foundry
30 articles about foundry in AI news
TSMC 2nm Capacity Constraints Create Opening for Samsung in AI Chip Foundry Race
TSMC has reportedly hit a 'hard capacity wall' at its 2nm node, creating a strategic opportunity for Samsung Foundry to capture AI accelerator business from major clients like Nvidia and OpenAI. This bottleneck could reshape the competitive landscape for advanced semiconductor manufacturing.
Building Sequential AI Workflows with Microsoft Agent Framework and Azure AI Foundry
A technical walkthrough of implementing a sequential agent workflow for security incident triage using Microsoft's Agent Framework and Azure AI Foundry. Demonstrates how to structure multi-stage AI processes where each agent builds on previous outputs with full conversation history.
Broadcom to Manufacture Google TPU Chips in Foundry Partnership
Google has licensed its Tensor Processing Unit (TPU) intellectual property to Broadcom for chip fabrication. This allows Google to earn from its IP while Broadcom manages the complex hardware build and networking integration.
Microsoft Merges AutoGen and Semantic Kernel into Agent Framework
Microsoft merged AutoGen and Semantic Kernel into Agent Framework, a unified production-grade framework for .NET and Python with graph-based workflows and Foundry deployment.
Anthropic Ships Claude Opus 5: Fable-Level Intelligence at Half the Price
Anthropic released Claude Opus 5 on July 24 with a 1M token context, 128k output, and Fable-5-approaching intelligence at half the price, unchanged from Opus 4.8.
China Builds First Phase-Change Memristor Neural Chip
Chinese researchers built the first phase-change memristor neural chip, claiming 10,000x energy efficiency but releasing no benchmarks.
zAI Completes 1-Gigawatt AI Data Center Without Nvidia Chips
zAI built a 1GW AI data center in China with no Nvidia chips, using only domestic silicon. It supports frontier GLM model development and has begun operations.
Silicon Photonics Hits 300-mm Wafer Scale for AI Interconnects
Silicon photonics moves to 300-mm wafers for AI interconnects, cutting cost per Gbps by ~30% and addressing bandwidth bottlenecks in 100,000+ GPU clusters.
TSMC Pledges Extra $100B for Arizona, Total US Investment Hits $265B
TSMC pledged $100B more for Arizona fabs, total US investment $265B, driven by AI chip demand. Net income surged 77% to $22B in Q2.
Google Chooses Intel EMIB-T for 9th-Gen TPUs, Breaking TSMC's CoWoS Monopoly
Google picks Intel EMIB-T for 9th-gen TPU, breaking TSMC CoWoS monopoly. Move signals architectural bet on power integrity and reticle-free scaling.
MITRE-Led Team Monolithically Integrates Piezo-Optomechanical Photonics
MITRE-led team demonstrated first monolithic CMOS platform for piezo-optomechanical photonics, achieving wafer-scale integration with 2.3x lower loss and 40% better bandwidth.
Crusoe Launches Serverless Fine-Tuning, Targets AI Lifecycle Beyond GPUs
Crusoe launched serverless fine-tuning and inference, targeting enterprise AI teams. IDC says GPU access is no longer the differentiator; portability is now a procurement requirement.
Chinese AI Firms Raise $20B in Hong Kong Amid US Chip Curbs
Chinese tech firms raised $20B in Hong Kong for AI and semiconductor expansion, driven by US chip export controls.
Meta Iris AI Chip Production May Start September – Report
Meta could produce Iris AI chip in September 2026 for data center inference, per report. Reduces NVIDIA reliance.
DeepSeek, Zhipu AI Build Custom Inference Chips to Cut GPU Dependency
DeepSeek and Zhipu AI are developing custom inference chips to cut GPU costs. China's domestic chip budget share hit 46% in July 2026.
Chinese Team Claims Carbon Nanotube CFET Breakthrough; Challenges TSMC at 2nm
Chinese team claims 3x carbon nanotube CFET gain over silicon at 2nm, bypassing EUV. No peer review; skepticism warranted.
Google TPU Humufish Drops TSMC CoWoS for Intel EMIB-T
Google's next TPU Humufish uses Intel EMIB-T packaging instead of TSMC CoWoS, breaking the industry default for AI accelerators.
Claude Hits Azure on Nvidia GB300 Blackwell, GA for Agent Workloads
Microsoft launched Claude models on Azure with Nvidia GB300 Blackwell GPUs, targeting enterprise agentic AI. First Blackwell deployment for Anthropic in a major cloud.
Qualcomm Taps TSMC for 3nm/2nm Dragonfly C100 CPUs, AI300 Accelerators
TSMC to fab Qualcomm's Dragonfly C100 and AI300 chips on 3nm/2nm nodes. The move challenges NVIDIA in data center AI, but timelines and performance remain undisclosed.
i10X Launches Supera Agent That Executes Full Workflows from Prompt
i10X launched Supera, an AI agent that autonomously executes multi-step workflows from a single prompt with user approval and cost transparency.
IBM Shows Sub-1-nm Chips, Targeting Production in 5 Years
IBM showed sub-1-nm chips at IEDM, targeting production in 5 years. It challenges TSMC and Intel in the race to shrink transistors for AI workloads.
OpenAI, Broadcom Unveil Jalapeño ASIC for LLM Inference
OpenAI and Broadcom unveiled Jalapeño, a custom ASIC for LLM inference, targeting volume deployment by late 2026. No performance metrics were disclosed.
Amazon Opens Trainium Chips to Outside Data Centers, Targeting Nvidia's Core Business
AWS AI chief Peter DeSantis confirmed Amazon is negotiating to sell Trainium chips externally for the first time, backed by Andy Jassy's estimate of a $50B annual revenue potential. With Trainium3 sold out, Trainium4 pre-booked, and Anthropic and OpenAI already running gigawatts of Trainium capacity
Claude Code v2.1.158: Enable Auto Mode on Bedrock, Vertex, and Azure Right Now
Claude Code v2.1.158 brings auto mode to Bedrock, Vertex, and Azure. Set `CLAUDE_CODE_ENABLE_AUTO_MODE=1` and upgrade before the June 1 deprecation of `CLAUDE_CODE_OPUS_4_6_FAST_MODE_OVERRIDE`.
Anthropic Releases Claude Mythos Publicly as 'Fable' at 2x Opus Price
Anthropic released Claude Mythos publicly as 'Fable' at 2x Opus pricing, targeting agent workflows with strong safety limits.
Memory Supply Squeeze Hits Non-AI Sectors as DRAM Prices Double
DRAM prices surged 93-98% QoQ in Q1 2026 as AI data centers consume fab capacity, nine industry groups warned the Trump administration on June 3, threatening supply for automotive, telecom, and medical devices.
Huawei Hits 1.5µm Bond Pitch in Kirin 2026 Chips, Beats TSMC
Huawei's 2026 Kirin chips achieve 1.5µm hybrid bonding pitch, 16-36x denser than TSMC. Next year targets 1µm.
SemiAnalysis: N3 chip demand far outstrips current consensus estimates
SemiAnalysis argues N3 chip demand far exceeds consensus accelerator models, implying a structural silicon shortage not priced by markets.
Microsoft Open-Sources AI Engineer Coach, a Fitbit for Dev Workflows
Microsoft open-sourced AI Engineer Coach, a VS Code extension that scores developer AI workflow quality across 5 categories with 45 anti-pattern rules.
Intel's UCIe-S Hits 48 Gb/s on 22nm, Beats 3nm EMIB
Intel demonstrated a UCIe-S die-to-die interconnect on 22nm hitting 48 Gb/s/lane over standard organic substrate, beating a 3nm EMIB design with 3× higher data rate and 2.8× higher bandwidth density. This signals a strategic shift away from EMIB for Intel's own products toward UCIe over substrate.