tsmc
30 articles about tsmc in AI news
TSMC Pledges Extra $100B for Arizona, Total US Investment Hits $265B
TSMC pledged $100B more for Arizona fabs, total US investment $265B, driven by AI chip demand. Net income surged 77% to $22B in Q2.
Google Chooses Intel EMIB-T for 9th-Gen TPUs, Breaking TSMC's CoWoS Monopoly
Google picks Intel EMIB-T for 9th-gen TPU, breaking TSMC CoWoS monopoly. Move signals architectural bet on power integrity and reticle-free scaling.
Google TPU Humufish Drops TSMC CoWoS for Intel EMIB-T
Google's next TPU Humufish uses Intel EMIB-T packaging instead of TSMC CoWoS, breaking the industry default for AI accelerators.
Qualcomm Taps TSMC for 3nm/2nm Dragonfly C100 CPUs, AI300 Accelerators
TSMC to fab Qualcomm's Dragonfly C100 and AI300 chips on 3nm/2nm nodes. The move challenges NVIDIA in data center AI, but timelines and performance remain undisclosed.
TSMC Cuts 28nm Output 25%+ as Advanced Node Push Accelerates
TSMC cut 28nm output over 25% since early 2026, reallocating to advanced nodes as AI demand surges. Mature node revenue share likely to shrink further.
Google Books Intel for 3M+ TPUs in 2028 as TSMC CoWoS Hits Capacity Wall
Google booked Intel to package 3M+ TPUs in 2028 as TSMC CoWoS capacity caps out. SK hynix tests HBM on Intel EMIB, potentially unlocking Nvidia's Feynman architecture.
Huawei Hits 1.5µm Bond Pitch in Kirin 2026 Chips, Beats TSMC
Huawei's 2026 Kirin chips achieve 1.5µm hybrid bonding pitch, 16-36x denser than TSMC. Next year targets 1µm.
Jensen Huang's 30-Year TSMC Battle: From 3D Graphics to AI GPUs
A 30-year-old comic shows Jensen Huang convincing TSMC to supply wafers for 3D graphics chips. Today, he's still fighting for wafer supply, but now for AI GPUs, alongside Broadcom, AMD, MediaTek, and Amazon.
TSMC's $56B 2026 CapEx Fuels AI Chip Race with 22 New Fabs
TSMC is constructing up to 22 advanced semiconductor fabs simultaneously, backed by a $52–56 billion capital expenditure plan for 2026. This unprecedented manufacturing scale is critical for producing the 2nm-and-below chips required by next-generation AI models.
TSMC 2nm Capacity Constraints Create Opening for Samsung in AI Chip Foundry Race
TSMC has reportedly hit a 'hard capacity wall' at its 2nm node, creating a strategic opportunity for Samsung Foundry to capture AI accelerator business from major clients like Nvidia and OpenAI. This bottleneck could reshape the competitive landscape for advanced semiconductor manufacturing.
Chinese Team Claims Carbon Nanotube CFET Breakthrough; Challenges TSMC at 2nm
Chinese team claims 3x carbon nanotube CFET gain over silicon at 2nm, bypassing EUV. No peer review; skepticism warranted.
Samsung Wins $200B Broadcom AI Chip Deal, Foundry Bet Pays Off
Samsung wins $200B Broadcom AI chip deal, boosting foundry push against TSMC. Partnership covers custom AI chips for data centers.
China PLP System Passes Validation at 510×515mm Panel Size
CFMEE validated a 510×515mm PLP system for AI chip packaging, challenging TSMC and Intel. The system targets HBM and AI accelerators, with potential 30% cost savings.
Etched Hits $5B Valuation, $1B in Orders for AI Inference Chip
Etched hits $5B valuation with $1B in orders for TSMC-made inference chips, raising $500M from top investors. The startup targets Nvidia's dominance.
IBM Shows Sub-1-nm Chips, Targeting Production in 5 Years
IBM showed sub-1-nm chips at IEDM, targeting production in 5 years. It challenges TSMC and Intel in the race to shrink transistors for AI workloads.
Houthi Threat to Bab el-Mandeb Strains AI Chip Supply Chain
Escalating Middle East conflict threatens two key maritime chokepoints, Bab el-Mandeb and Hormuz, jeopardizing the helium and energy supplies that underpin global advanced AI chip manufacturing at TSMC and SK Hynix.
Kirin 9030 metal pitch 32.5nm beats Intel 18A by 10%
Kirin 9030 metal pitch measured 32.5nm, beating Intel 18A by ~10%, achieved without EUV, per SemiAnalysis.
Silicon Photonics Hits 300-mm Wafer Scale for AI Interconnects
Silicon photonics moves to 300-mm wafers for AI interconnects, cutting cost per Gbps by ~30% and addressing bandwidth bottlenecks in 100,000+ GPU clusters.
Nvidia Vows 'Giant Amounts' of Vera Rubin as Blackwell Delays Bite
Nvidia CEO Huang pledges 'giant amounts' of Vera Rubin chips, asserting roadmap intact amid Blackwell delays. Japan's $2B+ Rubin factory anchors real demand.
Dongfang Suanxin Claims 14nm HBM-Free Chip Beats H200 Bandwidth
China's Dongfang Suanxin claims a 14nm HBM-free AI chip beats Nvidia H200 memory bandwidth, challenging US export controls.
Meta Iris AI Chip Production May Start September – Report
Meta could produce Iris AI chip in September 2026 for data center inference, per report. Reduces NVIDIA reliance.
POSTECH 10+ Layer Chip Stack Hits 4× Density of 12-Hi HBM
POSTECH developed 10+ layer chip stacking with 4× HBM density, targeting AI inference memory bottlenecks.
DeepSeek, Zhipu AI Build Custom Inference Chips to Cut GPU Dependency
DeepSeek and Zhipu AI are developing custom inference chips to cut GPU costs. China's domestic chip budget share hit 46% in July 2026.
Cargo thieves steal $1.3M in AI data center gear
Cargo thieves stole $1.3M in AI data center gear, targeting GPU shipments. Thefts expose supply chain vulnerability as AI hardware demand surges.
Stargate’s $500B AI Buildout Hits Energy and Financing Reality
Stargate, the $500B AI data center initiative backed by OpenAI, SoftBank, and Oracle, has progressed to real construction but faces mounting risks around energy, financing, and community consent.
OpenAI, Broadcom Unveil Jalapeño ASIC for LLM Inference
OpenAI and Broadcom unveiled Jalapeño, a custom ASIC for LLM inference, targeting volume deployment by late 2026. No performance metrics were disclosed.
SemiAnalysis Launches Mythos AI Research Platform
SemiAnalysis launched Mythos, a proprietary AI research platform for semiconductor and AI industry analysis, announced via Twitter on March 5, 2026.
Amazon Opens Trainium Chips to Outside Data Centers, Targeting Nvidia's Core Business
AWS AI chief Peter DeSantis confirmed Amazon is negotiating to sell Trainium chips externally for the first time, backed by Andy Jassy's estimate of a $50B annual revenue potential. With Trainium3 sold out, Trainium4 pre-booked, and Anthropic and OpenAI already running gigawatts of Trainium capacity
Qualcomm Launches AI Data Center Program With Hyperscaler Customer
Qualcomm launched an AI data center program with a major hyperscaler customer, targeting inference workloads. Financial terms and partner identity undisclosed.
ByteDance Builds In-House AI CPUs for TikTok-Scale Agent Inference
ByteDance builds custom AI CPUs for inference at TikTok scale, targeting scarce server supply. The move signals agent workload shift from training to inference hardware.